TJU Names Prof. Andrew Yeh-Ching Nee Honorary Professor

On November 16, ProfessorAndrew Yeh-Ching Nee from theNational University of Singapore was named to an Honorary Professorship at Tianjin University (TJU). Those attending the ceremony included Vice President Zhong Denghua, as well as representatives and professors from various schools.

At the ceremony, Vice President Zhong spoke highly of Professor Nee’s academic achievements. He also expressed his appreciation for Nee’s support and the long-term help that he has provided to the TJU School of Precision Instrument and Optoelectronics Engineering. He hoped that Professor Nee could continue helping in the development of TJU’s manufacturing engineering and precision instrument engineering disciplines.After the presentation of Nee’s profile and academic achievements by a TJU representative, Vice President Zhong conferred upon Nee the Honorary Professorship.

Professor Nee expressed his appreciation for being named an Honorary Professor. He stated that he would continue in-depth collaborations to promote the academic development of disciplines within the School of Precision Instruments and Optoelectronics Engineering.

After the conferring ceremony, Professor Nee presented a lecture entitled “Sustainable Manufacturing — Remanufacturing”.

Professor Nee is an internationally renowned professor of manufacturing engineering. He is the President of the International Academy for Production Engineering (CIRP) (2011-2012),a Founding Fellow of the Academy of Engineering Singapore, and the Co-Director of the Singapore-MIT Alliance(SMA), which is an innovative engineering education and research collaboration program that involves the National University of Singapore (NUS), Nanyang Technological University (NTU), and the Massachusetts Institute of Technology (MIT).He also serves asthe Deputy Executive Director, Science and Engineering Research Council (SERC) of the National Science and Technology Board.His research interest is the use of Computer aided design (CAD) in tool, die, fixture and process planning, and augmented reality applications in manufacturing.